The International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship scholarship provides $7,000 to Bachelor's, Graduate students across the United States. To support talented science and engineering students pursuing careers in the flexible packaging and extrusion industry and to encourage awareness of the International Flexible Packaging and Extrusion Division.
The International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship scholarship provides $7,000 to Bachelor's, Graduate students across the United States. To support talented science and engineering students pursuing careers in the flexible packaging and extrusion industry and to encourage awareness of the International Flexible Packaging and Extrusion Division.
This scholarship is open to Bachelor's, Graduate students across the United States.
The International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship scholarship awards $7,000.
The deadline is 2/15/2026.
Visit the official International Flexible Packaging and Extrusions - The Daniel Siegel Memorial Scholarship scholarship website to apply. ScholarshipAI can match you with thousands of similar scholarships — free of charge.